Thickness 1.0mm 
Inner copper thickness 1OZ 
Finished copper 0.5OZ 
Line width from 0.1 / 0.1mm 
Hole copper thickness 25um 
Minimum aperture 0.25mm 
BGA size 0.25mm 
Surface treatment Immersion Gold (nickel thick 3-5um, gold thick 0.025-0.05um) 
Applications of various types of mobile phone motherboard